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Automotive semiconductors and sensors from Bosch
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SiC power MOSFETs | SiC discrete portfolio 750 V

HVCPAK (Top side cooled)​

BT2M075

Efficient and robust power switches for on-board chargers, DC/DC converters and inverters

The HVCPAK is a top side cooled (TSC) package designed for high-power discrete products, specifically engineered for automotive applications. With its compact footprint of 14 mm x 18.6 mm and an area of approximately 285 mm², the HVCPAK is fully compatible with the HU3PAK standard, making it an ideal choice for modern automotive electronics. Its design enables higher power densities, allowing for more efficient performance in demanding applications.

Additionally, the enhanced cooling capabilities lead to substantial cost savings for cooling systems, while the compact footprint reduces space requirements on printed circuit boards (PCBs), resulting in further cost efficiencies.

The HVCPAK is designed for high power applications like on-board chargers, DC/DC converters and inverters in (hybrid) electric vehicles with system voltages around 400 V.

Benefits

SMD with improved cooling possibility

Bosch dual channel trench gate technology for lower RDS(on) × A

Switching speed adjustable with gate resistors

Target applications

On-board chargers, DC/DC converters and inverters in (hybrid) electric vehicles

Technical features HVCPAK (Top side cooled) – 2nd generation

BT2M0750013E7A BT2M0750028E7A
VDS
BT2M0750013E7A
750 V
BT2M0750028E7A
750 V
ID max
BT2M0750013E7A
95 A
BT2M0750028E7A
27,5 A
RDS(on) @ 50 % IDS max
BT2M0750013E7A
13 mΩ
BT2M0750028E7A
28 mΩ
Status
BT2M0750013E7A
In development
BT2M0750028E7A
In development
Type
Silicon carbide trench MOS
Drive voltage
-5 V ... 15 V or 18 V
Features
  • Kelvin source pin for reduced switching losses
  • High oxide reliability
Miller ratio (QGD/QGS)
<1
Tj min [°C]
-55 °C
Tj max [°C]
175 °C

Silicon carbide (SiC) power semiconductors from Bosch – SiC discretes

Bosch offers a comprehensive portfolio of silicon carbide (SiC) power semiconductors tailored meet the demanding needs of high-power applications. Our range includes bare dies, discretes, and power modules, guaranteeing the ideal solution for any application.

For packaged solutions, our SiC discretes are ideal for applications including on-board chargers, DC/DC converters, and inverters. These packaged versions ensure reliable performance and ease of integration into various power electronics system