Auto Shanghai 2025
April 23 - May 02, 2025
Shanghai, China, hall 4.1 at booth 4A15
Automotive semiconductors – directly from Bosch
At this year’s Auto Shanghai, we put the spotlight on new developments from our semiconductor and sensor portfolio. Bosch offers a wide range of SiC trench MOSFETs, MEMS sensors for various automotive applications, as well as ASoCs, ASICs, and IP modules. Our portfolio of standard solutions and customized semiconductors is directly available to OEMs, Tier1 and 2 suppliers, and distributors, additionally being integrated in various automotive components. Our experts will be happy to provide further details at our booth.
Join us at hall 4.1 booth 4A15 and have a closer look at this year’s highlights:
- The latest generations of our dual channel SiC trench MOSFETs for 1,200 V and 750 V.
- Highly efficient power electronics based on SiC technology, e.g. power modules and power modules on cooler.
- Our latest MEMS sensors for ADAS, safety and comfort applications including the new tire pressure sensor module SMP290 with bluetooth interface.
- Our innovative Radar SoC with integrated AI based signal processing
- IP modules for in-vehicle applications (CAN protocols) and the new CAN SIC XL transceiver with data rates of up to 20 Mbit/s